Special Technologies


Via - Fill
Specification
Characteristics

  Via Ø 0.2μm - 0.8μm

  Plugging Depth 30% - 100%

  Material :

  two component sensitive ink

  one component thermal cure ink

  - Prevents solder from flowing to the other
     side during Wave Soldering

  - Prevents short circuit between leads of BGA
Peelable
Specification
Characteristics

  Material :  PETERS Peelable Ink
                 SD2954 / SD2955

  Peelable thickness 0.3 - 0.6mm

  Control Accuracy ±0.1mm

  Endurable Soldering 1 - 2 times
 

  - Protects the area for one or two solderings

  - Protects the area from scratching during
    soldering

  - Variant colors

  - SD2955 for higher temperatures (lead-free)
Carbon
Specification
Characteristics

  Carbon Ink Thickness 8 - 20 μm

  Square Resistance < 50Ω

  - wear-resistant

  - long-lasting

  - cost-efficient for contact mating area
Characteristic Impedance
Specification
Characteristics

  General Impedance 50 - 100 Ω

  Control Accuracy ±10%

        50Ω = 1.00%

        75Ω = 1.25%

       100Ω = 1.50%

  - Assures high frequency or high speed
    during transmission of logic signals