Surfaces


HAL
Specification
Characteristics


  Hot Air Levelling

  Sn/Pb Thickness    1-25μm

  Sn/Pb Proportion    63:37

  Storable                12 - 18 months

  Conform to RoHS   No

  Multi solderable     Yes


  This surface is almost out of use since the
  RoHS (Restriction of Hazardous Substances)
  EU guidelines became valid July 1st, 2006.

  - constant technology

  - very well solderable


  - soldering
  - conductive adhesive
  - press-in technique
HAL (leadfree)
Specification
Characteristics


  Hot Air Levelling

  Name                  SN100C

  Alloy system         SnCuNi

  Storable               12 -18 months

  Conform to RoHS   Yes

  Multi solderable     Yes

  - new standard

  - constant technology

  - honour good soldering behavior during
    lead free the process


  - Wave soldering    250 - 260°C
  - Reflow                 240 - 245°C

  - soldering
  - conductive adhesive
  - press-in technique
Chemical Tin
Specification
Characteristics




  Tin Thickness         ≥0.8μm

  Storable                 max. 6 Monate

  Conform to RoHS    Yes

  Multi solderable      Yes


  - high-planar

  - solid manufacturing process

  - good soldering characteristics

  - suitable for very small structures


  - soldering
  - (conductive adhesive)
  - press-in technique
Chemical Gold
Specification
Characteristics



  Nickel Thickness      3 - 6μm
  Gold Thickness        0.05 - 1.2μm


  Storable                 10 - 12 months

  Conform to RoHS    Yes

  Multi solderable      Yes


  - high-planar

  - solid manufacturing process

  - good soldering characteristics

  - suitable for very small structures


  - soldering
  - conductive adhesive
  - bonding technique
Chemical Silver
Specification
Characteristics



  Silver Thickness      0.3 - 0.5μm
  Contact resistance   <0.1Ω


  Storable                 max. 6 months

  Conform to RoHS    Yes

  Multi solderable      Ja


  - high-planar

  - solid manufacturing process

  - good soldering characteristics

  - suitable for very small structures

  - good HF characteristics (skin effect)


  - soldering
  - (bonding technique)
OSP (Organic Solderability Preservative)
Specification
Characteristics



  Name                   ENTEK

  Thickness              0.25 - 0.60μm

  Storable                10 - 12 month

  Conform to RoHS   Yes

  Multi solderable      No



  - planar

  - suitable for very small structures

  - good soldering characteristics


  - soldering
Selective Gold Plating (gold finger)
Specification
Characteristics



  Nickel Thickness    3 - 10μm
  Gold Thickness      0.5 - 5.0μm


  Storable               10- 12 month

  Conform to RoHS   Yes



  - for contact areas and sliding contacts

  - small contact resistance

  - anti-oxidation

  - wear resistant