|
Number of Layers
|
1 - 14 Layers
|
|
Base Material
|
FR4, FR5, FR2, CEM1, CEM3, PTFE, Rogers, Aluminum
|
| |
|
Inch |
Millimeter |
|
Panel Size (max.)
|
1 to 2 Layers
|
17 x 23
|
431.8 x 584.2
|
|
3 to 14 Layers
|
17 x 23
|
431.8 x 584.2
|
|
Board Thickness
|
1 to 2 Layers
|
0.008 - 0.126
|
0.20 - 3.20
|
|
3 to 4 Layers
|
0.020 - 0.126
|
0.50 - 3.20
|
|
5 to 6 Layers
|
0.033 - 0.126
|
0.83 - 3.20
|
|
7 to 8 Layers
|
0.043 - 0.126
|
1.10 - 3.20
|
|
9 to 10 Layers
|
0.054 - 0.126
|
1.38 - 3.20
|
|
11 to 12 Layers
|
0.065 - 0.126
|
1.65 - 3.20
|
|
13 to 14 Layers
|
0.076 - 0.126
|
1.93 - 3.20
|
|
Core
|
0.004 - 0.039
|
0.10 - 1.0
|
|
Isolation Thickness
|
Minimal
|
0.004
|
0.10
|
|
Min Conductor Width/Space
|
Inner Layers 18μm
|
0.0030/0.0030
|
0.075/0.075
|
|
Inner Layers 35μm
|
0.0040/0.0040
|
0.100/0.100
|
|
Inner Layers 70μm
|
0.0059/0.0059
|
0.150/0.150
|
|
Outer Layers 18μm
|
0.0040/0.0040
|
0.100/0.100
|
|
Outer Layers 35μm
|
0.0059/0.0059
|
0.150/0.150
|
|
Outer Layers 70μm
|
0.0079/0.0079
|
0.200/0.200
|
|
Outer Layers 105μm
|
0.0118/0.0118
|
0.300/0.300
|
|
Smallest Hole Diameter
|
Via
|
0.0079
|
0.200
|
|
Component Hole
|
0.0160
|
0.400
|
|
Warp and Twist
|
≤0.8%
|
|
Blind and Buried Hole
|
ON SPECIAL REQUEST
|
|
Plating Copper Thickness
|
≥25μm
|
|
Coating
|
Solder Resist
|
Thickness: 15-25um or according to requests of customer
Clearance: 0.05mm (0.002in)
Color: green, blue, red and black; other colors available on demand |
|
Peeling Resist
|
Thickness: >=0.15mm (0.006in)
Color: green, blue and bright blue; other colors available on demand |
|
Routing
|
Tolerance
|
±0.004
|
±0.10
|
|
Scoring
|
Angle 15°, 30°,60°
|
|
Residue Thickness Tolerance
|
±0.0039
(thickness ≥0.0315)
|
±0.1
(thickness ≥0.8)
|
|
Bare-Board Tests (BBT)
|
Test voltage : 250V
Test current : 20mA
Minimal isolation resistance 10MΩ
Test grid ½ grid (1.27mm)
Minimal pitch 0.50mm |
|
Surface Technology
|
Hot Air Leveling (HAL) normal thickness ≥2μm |
| Hard Gold (galvanic) Ni 4 - 6μm Au 0.5 - 5μm |
| Chemical Ni/Au Ni 3 - 6μm (or more thickly) Au 0.05 - 0.10μm (or more thickly)
|
| ENTEK |
| Chemical Silver |
| Flash Gold Plating |
| Solder Resist |
| Carbon Ink Clearance 0.25mm (0.01in) |
| Peelable Resist |
| Via Fill (tenting) extent 30 - 100% Ø 0.2mm |
|
Legend Printing
|
Color : white, yellow
Positional tolerance ± 0.15mm (0.06in)
Minimal legend trace width = 0.15.mm ( 0.06in)
Minimal legend heigth = 0.8.mm (0.03in)
|
|
Acceptable Files/Data
|
Pattern
|
Gerber 274, Gerber D, Eagle, DPF, MDA, DXF
Protel99se, ODB++, IPC-D-350 |
|
Drill
|
Excellon1/Excellon2
Sieb & Meyer 1000
Sieb & Meyer 3000 |
|
Drawing
|
DXF, HPGL, Gerber, Autocad R14, PDF, TIFF
JPG, BMP, GIF, CAM350, Autocad 2000 |