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Via - Fill
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Specification
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Characteristics
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Via Ø 0.2μm - 0.8μm
Plugging Depth 30% - 100%
Material :
two component sensitive ink
one component thermal cure ink
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- Prevents solder from flowing to the other
side during Wave Soldering
- Prevents short circuit between leads of BGA
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Peelable
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Specification
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Characteristics
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Material : PETERS Peelable Ink
SD2954 / SD2955
Peelable thickness 0.3 - 0.6mm
Control Accuracy ±0.1mm
Endurable Soldering 1 - 2 times
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- Protects the area for one or two solderings
- Protects the area from scratching during
soldering
- Variant colors
- SD2955 for higher temperatures (lead-free)
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Carbon
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Specification
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Characteristics
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Carbon Ink Thickness 8 - 20 μm
Square Resistance < 50Ω
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- wear-resistant
- long-lasting
- cost-efficient for contact mating area
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Characteristic Impedance
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Specification
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Characteristics
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General Impedance 50 - 100 Ω
Control Accuracy ±10%
50Ω = 1.00%
75Ω = 1.25%
100Ω = 1.50%
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- Assures high frequency or high speed
during transmission of logic signals
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